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Principal Packaging Engineer
Job Summary
Advertiser
Salary / Rate
Posted
IC Resources
Neg
19th March 2026
Location
Start Date
Wales
Type
Job Sector
{}
Engineering & Aerospace
My client is looking for a Principal Semiconductor Packaging Engineer to lead the development of next-generation 2.5D and 3D packaging technologies. What you’ll do: Architect innovative 2.5D/3D packaging solutions from concept to prototype. Lead advanced packaging R&D programmes and technology roadmaps. Oversee design, assembly, test, and validation of complex semiconductor packages. Collaborate across teams to solve system-level packaging challenges. Represent the company in technical discussions, bids, and industry forums. What we’re looking for: Strong experience in semiconductor package design and development (3D/2.5D) Proven track record leading microelectronics packaging projects . Deep understanding of design, modelling, and validation processes . Excellent communication, leadership, and problem-solving skills. Benefits: Competitive salary 15% pension (10% employer) Annual bonus Private medical cover extended to family Sponsorship with up to £5000 in relocation fees If you're…
